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    • 专利摘要:
    The hot melt adhesive composition of the present invention is 100 parts by weight of the tackifier (B) and 1 to 900 parts by weight of the α-olefin / aromatic vinyl compound random copolymer (C). Moreover, the resin composition of this invention consists of 100 weight part of base polymers (A), 1-900 weight part of components (B), and 1-1,000 weight part of components (C). Moreover, the resin composition of this invention consists of 100 weight part of components (A), 10-300 weight part of components (B), and 10-400 weight part of components (C). The component (A) is preferably at least one polymer selected from the group consisting of polyolefin (a-1), polar group-containing polymer (a-2) and aromatic vinyl compound / conjugated diene copolymer (a-3). These hot melt adhesive compositions are excellent in adhesive strength and can be used as an adhesive for styrene resins.
    公开号:KR20000070535A
    申请号:KR1019997006780
    申请日:1998-01-21
    公开日:2000-11-25
    发明作者:모리조노겐이찌；오까다게이지；도끼따수구루
    申请人:나까니시 히로유끼；미쓰이 가가쿠 가부시키가이샤；
    IPC主号:
    专利说明:

    Hot Melt Adhesive Composition {HOT MELT ADHESIVE COMPOSITIONS}
    Hot melt adhesives based on polymers such as polyolefins, polyamides, polyesters, vinyl acetate copolymers, cellulose derivatives, polymethyl methacrylates, polyvinyl ethers or polyurethanes, with the addition of a tackifier to the substrate It is known to have good adhesion effects when applied to labels, kraft tape, cloth tape and heated.
    Recently, hot melt adhesives are superior in application speed, stability, workability and energy saving compared to conventional solvent type adhesives, and thus the field of application is increasing. Conventional hot melt adhesives are EVA or styrene / conjugated diene block copolymers as base polymers, tackifiers added to the base polymers, and low molecular weight polyolefins.
    In recent years, there has been a demand for high performance of adhesives, and adhesives having high adhesive strength are required for various materials.
    For example, increasing the styrene content in a styrene / conjugated diene block copolymer based adhesive improves the heat resistance of the adhesive, but the adhesive strength of the resulting adhesive is not sufficient, thus achieving a desirable balance between the heat resistance of the adhesive and the adhesive properties. It was difficult to do.
    Purpose of the Invention
    This invention is made | formed in view of said prior art. It is an object of the present invention to provide a hot melt adhesive composition having excellent adhesive strength.
    The present invention relates to a hot melt adhesive composition. More specifically, the present invention relates to a hot melt adhesive composition which is excellent in adhesive strength and can be used as an adhesive for styrene resins.
    Summary of the Invention
    The first hot melt adhesive composition of the present invention,
    100 parts by weight of a tackifier (B), and
    1-900 weight part of alpha-olefin / aromatic vinyl compound random copolymers (C).
    The second hot melt adhesive composition of the present invention,
    100 parts by weight of the base polymer (A),
    1 to 900 parts by weight of the tackifier (B), and
    It consists of 1-1000 weight part of alpha-olefin / aromatic vinyl compound random copolymers (C).
    The third hot melt adhesive composition of the present invention,
    100 parts by weight of the base polymer (A),
    10 to 300 parts by weight of the tackifier (B), and
    It consists of 10-400 weight part of alpha-olefin / aromatic vinyl compound random copolymers (C).
    In the present invention, the base polymer (A) is selected from the group consisting of polyolefin (a-1), a polymer containing a polar group (a-2) and an aromatic vinyl compound / conjugated diene copolymer (a-3), for example. At least one polymer. Among these, an aromatic vinyl compound / conjugated diene copolymer (a-3) is preferable.
    In the present invention, it is preferable that the α-olefin / aromatic vinyl compound random copolymer (C) is an ethylene / aromatic vinyl compound random copolymer, and the α-olefin / aromatic vinyl compound random copolymer (C) is derived from an aromatic vinyl compound. It is preferable to contain 1 to 80 mol% of the obtained structural unit.
    In addition, the second and third hot melt adhesive composition of the present invention is added to the base polymer (A), the tackifier (B) and the α-olefin / aromatic vinyl compound random copolymer (C) to add a low molecular weight polyolefin (D). You may further contain 1-100 weight part per 100 weight part of base polymer (A).
    The first hot melt adhesive composition of the present invention is a low molecular weight polyolefin having an intrinsic viscosity ( ) Of 0.01 to 0.6 dl / g in addition to the tackifier (B) and the -Olefin / aromatic vinyl compound random copolymer (C) ( D) may further comprise 1 to 100 parts by weight per 100 parts by weight of the adhesion imparting agent (B).
    Detailed description of the invention
    The hot melt adhesive composition of the present invention is described in detail below.
    The 1st hot melt adhesive composition of this invention consists of a tackifier (B) and an alpha-olefin / aromatic vinyl compound random copolymer (C), and a low molecular weight polyolefin (D) as needed.
    The second and third hot melt adhesive compositions of the present invention comprise a base polymer (A), a tackifier (B), and an α-olefin / aromatic vinyl compound random copolymer (C), and a low molecular weight polyolefin (D), if necessary. have.
    First, the component (A), (B), (C) and (D) used for this invention are demonstrated.
    Base Polymer (A)
    The base polymer (A) added as needed in the present invention is not particularly limited as long as it is a polymer usually used in a conventional hot melt adhesive. Examples of suitable base polymers (A) include polyolefins (a-1), polymers containing polar groups (a-2) and aromatic vinyl compounds / conjugated diene copolymers (a-3).
    Polyolefin (a-1)
    Examples of these include
    Polyethylenes (HDPE, LDPE, LLDPE, etc.),
    Polypropylenes (atactic polypropylene, syndiotactic polypropylene, etc.), and
    Ethylene / propylene copolymers.
    Polymer (a-2) containing a polar group
    Examples of these include
    (1) ethylene / vinylacetate copolymer (EVA),
    (2) modified EVA polymers such as saponified EVA and graft modified EVA,
    (3) ethylene / (meth) acrylate copolymers such as ethylene / ethyl (meth) acrylate (EEA),
    (4) ionomer resins obtained by partially neutralizing the ethylene / (meth) acrylic acid copolymers (e.g., Himilan (trade name, manufactured by Mitsui-DuPont Polychemical)),
    (5) ethylene / propylene / (meth) acrylic acid terpolymer,
    (6) polyamides: reaction products of dibasic acids and diamines, for example, reaction products of dimer acids which are dimers of fatty acids such as soybean oil, tung dil or tall oil with alkyldiamines such as ethylenediamine or diethylenetriamine, and Nylons, such as nylon 12, are mentioned, and Examples of these commercially available polymers include diamide (trade name, the product made by Daicel Chemical), Platyron (trade name, the product made by Toakosei), and Amylan (trade name, the product made by Toray Corporation). Can be.
    (7) polyesters, such as commercially available examples of these polymers, include ester resins 200 or 300 (trade name, manufactured by Toyobo) and Vitel 200 or 300 (trade name, manufactured by Goodyear Tire & Rubber, Inc.); and
    (8) vinyl acetate copolymers such as vinyl acetate / crotonic acid copolymer, vinyl acetate / phthalic anhydride copolymer and vinyl acetate / vinylpyrrolidone copolymer, cellulose derivative polymer, polymethyl methacrylate polymer, polyvinyl ether polymer, Polyurethane polymers and thermosetting polymers,
    Can be mentioned.
    Aromatic vinyl compound / conjugated diene copolymer (a-3)
    The aromatic vinyl compound / conjugated diene copolymer (a-3) is a copolymer of an aromatic vinyl compound and a conjugated diene compound or a hydrogenated product thereof. Examples of these include styrene / butadiene random copolymer, styrene / isoprene random copolymer, butadiene / polystyrene block copolymer, polystyrene / polyisoprene block copolymer, polystyrene / polyisoprene / polystyrene triblock copolymer, polystyrene / polybutadiene / polystyrene Triblock copolymers, poly (α-methylstyrene) / polybutadiene / poly (α-methylstyrene) triblock copolymers and their hydrogenated materials. These polymers are commercially available in both the hydrogenated and non-hydrogenated materials. Examples of the commercially available polymers include Carriflex TR-1101, TR-1107 and TR-4113 (trade name, manufactured by Shell Chemical), Creton G-6500, G-6521, G-1650, G-1652 and G-1657 ( Trade name, Shell Chemicals) and sorbene and sorbene hydride (trade name, manufactured by Philip).
    In the present invention, the base polymer may be used alone or in combination. Among the polymers, aromatic vinyl compounds / conjugated diene copolymers and their hydrogenated materials are preferred. Especially preferred are aromatic vinyl compounds / conjugated diene copolymers.
    Tackifier (B)
    The tackifier (B) used by this invention is added in order to adjust the melt viscosity of a base polymer (A), and to improve the high temperature viscosity and wettability of a base polymer (A). The tackifier (B) is not particularly limited as long as the high temperature viscosity and wettability of the base polymer (A) can be improved when blended with the base polymer (A) and heated.
    Suitable examples of tackifiers (B) include cycloaliphatic tackifiers, rosin (modified or unmodified rosin, esters thereof), aliphatic petroleum resins, alicyclic petroleum resins, aromatic petroleum resins, aliphatic and aromatic components. Copolymer petroleum resins, low molecular weight styrene resins, isoprene resins, alkyl phenol resins, terpene resins and coumarone indene resins. These tackifiers (B) can be used individually or in combination in this invention.
    α-olefin / aromatic vinyl compound random copolymer (C)
    The alpha -olefin / aromatic vinyl compound random copolymer (C) used in the present invention is a random copolymer of alpha -olefin and an aromatic vinyl compound. The α-olefin may be ethylene, propylene, 1-butene, 3-methyl-1-butene, 4-methyl-1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1-heptene, 1 -Octene, 1-nonene, 1-decene, 1-undecene, 1-dodecene, 1-tridecene, 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-heptadecene, 1-octadecene It is chosen from C2-C20 alpha olefins, such as 1-nonadecene and 1-eicodeesene. The α-olefins may be used alone or in combination.
    Suitable examples of such aromatic vinyl compounds include styrene; mono or poly alkylstyrenes such as o-methylstyrene, m-methylstyrene, p-methylstyrene, o, p-dimethylstyrene, o-ethylstyrene, m-ethylstyrene and p-ethylstyrene; Styrene derivatives containing functional groups such as methoxy styrene, ethoxy styrene, vinyl benzoic acid, methyl vinyl benzoate, vinyl benzyl acetate, hydroxy styrene, o-chloro styrene, p-chloro styrene and divinyl benzene; 3-phenylpropylene, 4-phenylbutene, and (alpha) -methylstyrene are mentioned. Among these, styrene and 4-methoxy styrene are preferable.
    The α-olefin / aromatic vinyl compound random copolymer (C) has a structural unit derived from α-olefin of 99.9 to 20 mol%, preferably 99 to 50 mol%, more preferably 99 to 70 mol%, aromatic The structural unit derived from the vinyl compound is 0.1 to 80 mol%, preferably 1 to 50 mol%, more preferably 1 to 30 mol%. When the content of the structural unit derived from the aromatic vinyl compound is outside the above range, the adhesive property is deteriorated.
    As for the (alpha) -olefin / aromatic vinyl compound random copolymer (C) used by this invention, the random copolymer of ethylene, an aromatic vinyl compound, and the C3-C20 alpha-olefin is preferable. Suitable examples of α-olefins are propylene, 1-butene, 3-methyl-1-butene, 4-methyl-1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1-heptene, 1 -Octene, 1-nonene, 1-decene, 1-undecene, 1-dodecene, 1-tridecene, 1-tetradecene, 1-pentadecene, 1-hexadecene, 1-heptadecene, 1-octadecene , 1-nonadecene and 1-eicodecene. Of these, 1-butene, 1-pentene, 1-hexene and 1-octene are preferred. The α-olefins may be used alone or in combination.
    In the copolymer obtained from the ethylene and the aromatic vinyl compound and, if necessary, the α-olefin, the molar ratio (ethylene / α-olefin) of the structural unit derived from ethylene to the structural unit derived from the α-olefin having 3 to 20 carbon atoms is Usually 100 / 0-40 / 60, Preferably it is 100 / 0-60 / 40, More preferably, it is 100 / 0-70 / 30.
    When the molar ratio of the structural unit derived from ethylene to the structural unit derived from alpha -olefin having 3 to 20 carbon atoms is in the above range, the adhesive property is excellent.
    In the copolymerization of the α-olefin / aromatic vinyl compound random copolymer, other monomers such as nonconjugated dienes may be used. Suitable examples of nonconjugated dienes include 1,4-pentadiene, 1,4-hexadiene, 4-methyl-1,5-heptadiene, 5-methylene-2-norbornene, 5-ethylidene-2-nor Bornen, 5-isopropenyl-2-norbornene, 2,5-norbornadiene, 1,6-cyclooctadiene, 2-ethylene-2,5-norbornadiene, 2-isopropenyl -2,5-norbornadiene, dicyclopentadiene, 1,6-octadiene, 1,7-octadiene, tricyclopentadiene and dihydrodicyclopentadienyloxyethylene, and also acrylic acid And esters with unsaturated carboxylic acids such as methacrylic acid, itaconic acid, maleic acid and fumaric acid. These may be used alone or in combination.
    It is preferable that the said alpha-olefin / aromatic vinyl compound random copolymer has intrinsic viscosity ((eta)) measured in 135 degreeC decalin having 0.01-10 dl / g. When the intrinsic viscosity η is in the range of 0.01 to 0.6 dl / g, the resulting hot melt adhesive exhibits satisfactory performance. When the intrinsic viscosity η exceeds 0.6 dl / g and is 10 dl / g or less, handling becomes easy when a low molecular weight polymer is added to improve workability (melt viscosity, spreading prevention).
    The α-olefin / aromatic vinyl compound random copolymer used in the present invention has a structural unit derived from an aromatic vinyl compound with respect to the structural unit derived from the aromatic vinyl compound from the viewpoint of adhesive strength and ease of handling at high temperature melting. The proportion of the structural units constituting the chain structure arranged in succession is preferably 1% or less, particularly 0.1% or less. The content of the chain structure in which at least two consecutive structural units derived from an aromatic vinyl compound are arranged can be measured by 13 C-NMR.
    When the α-olefin / aromatic vinyl compound random copolymer is an ethylene / aromatic vinyl compound random copolymer, the B value obtained from the 13 C-NMR spectrum and the following formula is usually 0.80 to 2.00, preferably 0.85 to 1.50, more preferably Preferably it is 0.95-1.45, Most preferably, 1.00-1.40.
    B value = (P SE ) / (2- (P E )-(P S ))
    Where (P E ) is the molar fraction of the structural units derived from ethylene (ethylene units) in the ethylene / aromatic vinyl compound random copolymer, (P S ) is the aromatic vinyl compound in the ethylene / aromatic vinyl compound random copolymer The molar fraction of the structural units derived from (aromatic vinyl compound units), (P SE ) is the ratio of aromatic vinyl compound units / ethylene unit chains to the total amount of the diamond chains in the ethylene / aromatic vinyl compound random copolymer. Is displayed.)
    The B value obtained from the above formula is an index indicating the dispersion state of ethylene units and aromatic vinyl compound units in the polymer. The B value can be obtained by referring to JCRandall (Macromolecules, 15,353 (1982)) and J. Ray (Macromolecules, 10,773 (1977)) The larger the value of B, the shorter the chain of ethylene or aromatic vinyl compound units. Therefore, it shows that the distribution of ethylene units or aromatic vinyl compound units is uniform, while the smaller the B value is 1.00, the longer the distribution of the ethylene / aromatic vinyl compound random copolymer is, and therefore, the longer the block chain.
    The method for producing the α-olefin / aromatic vinyl compound random copolymer is described below.
    The α-olefin / aromatic vinyl compound random copolymer used in the present invention can be produced by copolymerizing ethylene with an aromatic vinyl compound and, if necessary, an α-olefin having 3 to 20 carbon atoms in the presence of a metallocene catalyst (a). .
    As the metallocene catalyst (a), any of a metallocene catalyst and a similar metallocene catalyst that have been conventionally used as a single site catalyst can be used without particular limitation. Specifically, it is preferable to use a catalyst composed of a metallocene compound (transition metal compound) (b), an organoaluminum oxy compound (c) and / or an ionizing ionic compound (d) of a transition metal.
    Suitable examples of the metallocene compound (b) include metallocene compounds of transition metals selected from elements of group IV of the periodic table (long period table) represented by the family numbers 1-18 according to the revised edition of the IUPAC inorganic chemical nomenclature, specifically The metallocene compound represented by a formula is mentioned.
    ML x (1)
    In formula (1), M represents a transition metal selected from elements of group IV of the periodic table, for example zirconium, titanium or hafnium, x is the valence of the transition metal,
    L represents a ligand that coordinates to the transition metal. At least one of these ligands has a cyclopentadienyl skeleton. The ligand which has the said cyclopentadienyl skeleton may have a substituent.
    Suitable examples of ligands having a cyclopentadienyl skeleton include cyclopentadienyl groups; Methylcyclopentadienyl group, ethylcyclopentadienyl group, n- or i-propylcyclopentadienyl group, n-, i-, sec- or t-butylcyclopentadienyl group, hexylcyclopentadienyl group, octylcyclopenta Dienyl group, dimethylcyclopentadienyl group, trimethylcyclopentadienyl group, tetramethylcyclopentadienyl group, pentamethylcyclopentadienyl group, methylethylcyclopentadienyl group, methylpropylcyclopentadienyl group, methylbutylcyclopentadienyl group, Alkyl- or cycloalkyl substituted cyclopentadienyl groups such as methylhexylcyclopentadienyl group, methylbenzylcyclopentadienyl group, ethylbutylcyclopentadienyl group, ethylhexylcyclopentadienyl group and methylcyclohexylcyclopentadienyl group ; And indenyl groups, 4,5,6,7-tetrahydroindenyl groups, and fluorenyl groups.
    These groups may be substituted with halogen atoms, trialkylsilyl groups and the like.
    Among these groups, alkyl substituted cyclopentadienyl groups are preferred.
    When the metallocene compound (b) of the formula (1) has at least two groups having a cyclopentadienyl skeleton as the ligand L, two of the groups having a cyclopentadienyl skeleton are alkylene groups such as ethylene or propylene. May be bonded to each other via a substituted alkylene group such as isopropylidene or diphenylmethylene, a silylene group or a substituted silylene group such as dimethylsilyl, diphenylsilylene or methylphenylsilylene.
    Examples of other L other than a ligand having a cyclopentadienyl skeleton include a hydrocarbon group having 1 to 12 carbon atoms, an alkoxy group, an aryloxy group, a formula -SO 3 R 1 (wherein R 1 is an alkyl group, an alkyl group substituted with a halogen atom, and an aryl group). Or an aryl group substituted with a halogen atom or an alkyl group), a sulfonic acid-containing group, a halogen atom and a hydrogen atom.
    Suitable examples of the hydrocarbon group having 1 to 12 carbon atoms include an alkyl group, a cycloalkyl group, an aryl group and an aralkyl group. Specific examples of the hydrocarbon group include
    Alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, t-butyl, pentyl, hexyl, octyl, decyl or dodecyl;
    Cycloalkyl groups such as cyclopentyl or cyclohexyl;
    Allyl groups such as phenyl or tolyl; And
    Aralkyl groups, such as benzyl or neofill, are mentioned.
    Suitable examples of alkoxy groups include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, sec-butoxy, t-butoxy, pentoxy, hexoxy and octosi. have.
    Suitable examples of the aryloxy group include phenoxy.
    Suitable examples of the sulfonic acid containing group represented by the formula -SO 3 R 1 include methanesulfonate, p-toluenesulfonate, trifluoromethanesulfonate and p-chlorobenzenesulfonate.
    Suitable examples of halogen atoms include fluorine, chlorine, bromine and iodine.
    When the valence of the transition metal is 4, the metallocene compound (b) of Formula (1) may be specifically represented by the following formula.
    R 2 k R 3 1 R 4 m R 5 n M (2)
    (Wherein M represents a transition metal, preferably zirconium or titanium as in formula (1); R 2 represents a group having a cyclopentadienyl skeleton (ligand); R 3 , R 4 and R 5 May be the same as or different from each other, each is the same group as L other than the group having a cyclopentadienyl skeleton or a group having a cyclopentadienyl skeleton used in the formula (1); k is an integer of 1 or more Satisfies the relation k + l + m + n = 4.)
    In the present invention, the metallocene compound (b) may be represented by the following formula.
    L 1 M 2 Z 1 2 (3)
    Wherein M 2 represents a metal of Group IV or lanthanide series of the periodic table;
    L 1 represents a derivative of a delocalized π bond group and imparts a limiting geometry to the active site of the metal M 2 ;
    Z 1 may be the same or different from each other, and each represents a hydrogen atom, a halogen atom, or a hydrocarbon group, a silyl group, and a germanyl group containing 20 or less carbon atoms, silicon atoms, and germanium atoms.)
    It is preferable to use the metallocene compound represented by a following formula among the metallocene compound (b) of General formula (3).

    (Wherein M 3 is titanium, zirconium or hafnium and Z 1 is as described above,
    Cp represents an unsubstituted or substituted cyclopentadienyl group or a derivative thereof, is π bonded to M 3 in the form of a η 5 bond,
    W 1 represents oxygen, sulfur, boron, an element of group 14 of the periodic table, or a group containing these elements,
    V 1 represents a ligand containing nitrogen, phosphorus, oxygen or sulfur,
    W 1 and V 1 may form a condensed ring, and Cp and W 1 may form a condensed ring.)
    As group represented by Cp of said Formula (4), a cyclopentadienyl group, an indenyl group, a fluorenyl group, and their saturated derivatives are preferable. These form a ring together with the metal atom (M 3 ). In the cyclopentadienyl group, each carbon atom is a hydrocarbyl group, a substituted hydrocarbyl group (at least one hydrogen atom is replaced by a halogen atom), a hydrocarbyl substituted metalloid group (metalloid is selected from group 14 elements of the periodic table) and halogen It may be substituted by the same or different group selected from the group which consists of groups, and may be unsubstituted. A plurality of substituents may be combined to form a condensed ring. Preferred substituted or unsubstituted hydrocarbyl groups capable of substituting at least one hydrogen atom in the cyclopentadienyl group include 1 to 20 carbon atoms, and are linear or branched alkyl groups, alicyclic hydrocarbon groups, and alkyl substituted cyclic groups. Hydrocarbon groups, aromatic groups and alkyl-substituted aromatic groups. Examples of preferred organic metalloid groups are mono-, di- and tri-substituted organometallic groups of group 14 elements. Each of the hydrocarbyl contains 1 to 20 carbon atoms. Preferred specific examples of the organometallic group include trimethylsilyl, triethylsilyl, ethyldimethylsilyl, methyldiethylsilyl, phenyldimethylsilyl, methyldiphenylsilyl, triphenylsilyl, triphenylgeryl and trimethylgeryl. .
    Z of the formula (4)Onesilver For example, hydrides, halo, alkyl, silyl, germanyl, aryl, amide, aryloxy, alkoxy, phosphide, sulfide, pseudohalides such as acyl, cyanide or azide, acetylacetonates or mixtures thereof, respectively. May be the same or different.
    Examples of the compound represented by the formula (4),
    (Dimethyl (t-butylamido) (tetramethyl-η 5 -cyclopentadienyl) silane) titanium dichloride; And (t-butylamido) (tetramethyl-η 5 -cyclopentadienyl) -1,2-ethanediyl) titanium dichloride.
    Of the various metallocene compounds (b), the metallocene compound represented by the general formula (3) is particularly preferable in view of the polymerization activity and the transparency, rigidity, heat resistance and impact resistance of the molded article. The metallocene compound (b) described above may be used alone or in combination.
    Each metallocene compound (b) used in the present invention may be diluted with a hydrocarbon or a halogenated hydrocarbon prior to use.
    The organoaluminum oxy compound (c) and ionization ionic compound (d) used for formation of the said metallocene catalyst (a) are demonstrated below.
    The organoaluminum oxy compound (c) used for this invention may be a conventional aluminoxane (c) or the benzene insoluble organoaluminum oxy compound (c) interposed as an example in Unexamined-Japanese-Patent 2-78687.
    The aluminoxane (c) is prepared by the following method, for example, and is usually recovered as a solution of a hydrocarbon solvent.
    (1) An organoaluminum compound, such as trialkylaluminum, is added to an aromatic hydrocarbon solvent in which an adsorbed water-containing compound such as magnesium chloride hydrate, copper sulfate hydrate, aluminum sulfate hydrate, nickel sulfate hydrate, or cerium chloride hydrate is suspended or a crystallized water-containing salt is suspended. To recover the product into a solution of an aromatic hydrocarbon solvent.
    (2) In a solvent such as benzene, toluene, ethyl ether or tetrahydrofuran, an organic aluminum compound such as trialkylaluminum is directly reacted with water (liquid water, ice or steam) to recover the product as a solution of an aromatic hydrocarbon solvent. How to.
    (3) A method of reacting an organoaluminum compound such as trialkylaluminum with an organic tin oxide such as dimethyltin oxide or dibutyltin oxide in a hydrocarbon solvent such as decane, benzene or toluene.
    Preferred examples of the ionizing ionic compound (d) include a Lewis acid, an ionic compound, a borane compound and a carborane compound. These ionizing ionic compounds (d) are described in Japanese Patent Application Laid-Open No. 1-501950, Japanese Patent Application Laid-Open No. 1-502036, Japanese Patent Application Laid-Open No. 3-179005, Japanese Patent Application Laid-Open No. 3-207703, and Japanese Patent Application Laid-Open No. It is.
    The Lewis acid used as the ionizing ionic compound (d) is, for example, BR 3 (R may be the same or different from each other, and each is a phenyl group unsubstituted or substituted with a fluorine atom or a fluorine atom, a methyl group, a trifluoromethyl group, etc.). It is an arbitrary compound represented by). Suitable examples of Lewis acids include trifluoroboron, triphenylboron, tris (4-fluorophenyl) boron, tris (3,5-difluorophenyl) boron, tris (4-fluoromethylphenyl) boron and tris ( Pentafluorophenyl) boron is mentioned.
    The ionic compound used as the ionizing ionic compound (d) is a salt composed of a cationic compound and an anionic compound. The anion compound reacts with the metallocene compound (b) to cation the metallocene compound (b) to form ion pairs, and as a result, the anion compound serves to stabilize the transition metal cation species. Suitable examples of anions include organoboron compound anions, organoarsenic compound anions and organoaluminum compound anions. Of these, relatively bulky anions capable of stabilizing transition metal cationic species are preferred. Suitable examples of cations include metal cations, organometallic cations, carbonium cations, tritium cations, oxonium cations, sulfonium cations, phosphonium cations and ammonium cations. Specific cations include triphenylcarbenium cation, tributylammonium cation, N, N-dimethylammonium cation and ferrocenium cation.
    Among the above compounds, ionic compounds containing boron compounds as the anionic compounds are preferable, and in particular, as the ionic compounds, trialkyl substituted ammonium salts, N, N-dialkylanilinium salts, dialkylammonium salts and tri Aryl phosphonium salt is mentioned.
    Examples of the trialkyl substituted ammonium salts include triethylammonium tetra (phenyl) boride, tripropylammonium tetra (phenyl) boride, tri (n-butyl) ammonium tetra (phenyl) boride and trimethylammonium tetra (p-tolyl) Boride.
    Examples of the N, N-dialkylanilinium salt include N, N-dimethylanilinium tetra (phenyl) boride.
    Examples of the dialkylammonium salts include di (n-propyl) ammonium tetra (pentafluorophenyl) boride and dicyclohexylammonium tetra (phenyl) boride.
    Examples of the triarylphosphonium salts include triphenylphosphonium tetra (phenyl) boride, tri (methylphenyl) phosphonium tetra (phenyl) boride and tri (dimethylphenyl) phosphonium tetra (phenyl) boride.
    Further, as the ionic compound, triphenylcarbenium tetrakis (pentafluorophenyl) borate, N, N-dimethylanilinium tetrakis (pentafluorophenyl) borate, ferrocenium tetra (pentafluorophenyl) borate and the like You can hear more.
    Examples of the borane compound used as the ionizing ionic compound (d),
    Decaborane (14);
    Anionic salts such as bis (tri (n-butyl) ammonium) nonaborate and bis (tri (n-butyl) ammonium) decaborate; And
    Tri (n-butyl) ammonium bis (dodecahydride dodecaborate) cobalt acid salt (III) and bis (tri (n-butyl) ammonium) bis (dodecahydride dodecaborate) nickel acid salt (III) Metal borane anion salts, such as these, are mentioned.
    Examples of the carborane compound used as the ionizing ionic compound (d) include
    Anionic salts such as 4-carbanonaborane (14) and 1,3-dicarbanonaborane (13); And
    Tri (n-butyl) ammonium bis (nonahydride-1,3-dicarbanonaborate) cobalt acid salt (III) and tri (n-butyl) ammonium bis (undecahydride-7,8-dicarounde Metal carborane anion salts such as carborate) iron acid salt (III).
    You may use the said ionizing ionic compound (d) in combination.
    The metallocene catalyst (a) used by this invention may contain the following organoaluminum compound (e) in addition to the said component.
    The organoaluminum compound (e) used as needed is represented by the following general formula.
    (R 6 ) n AlX 3-n (5)
    (Wherein R 6 represents a hydrocarbon group of 1 to 15 carbon atoms, preferably 1 to 4; X is a halogen atom or a hydrogen atom; n is 1 to 3)
    Examples of the hydrocarbon group having 1 to 15 carbon atoms include an alkyl group, a cycloalkyl group, and an aryl group. Specifically methyl, ethyl, n-propyl, isopropyl or isobutyl are used.
    Suitable examples of organoaluminum compounds are
    Trialkyl aluminum, such as trimethyl aluminum, triethyl aluminum, triisopropyl aluminum, tri-n-butyl aluminum, triisobutyl aluminum and tri-sec-butyl aluminum;
    Alkenyl aluminum, such as isoprenyl aluminum, represented by the general formula (iC 4 H 9 ) x Al y (C 5 H 10 ) z (where x, y and z are positive, and z and x satisfy a z≥2x relationship) ;
    Dialkylaluminum halides such as dimethylaluminum chloride and diisobutylaluminum chloride;
    Dialkyl aluminum hydrides such as diisobutyl aluminum hydride;
    Dialkylaluminum alkoxides such as dimethylaluminum methoxide; And
    And dialkyl aluminum aryl oxides such as diethyl aluminum phenoxide.
    Copolymerization of ethylene and an aromatic vinyl compound and, if necessary, an α-olefin having 3 to 20 carbon atoms may be carried out either batchwise or continuously. When copolymerization is performed continuously, the said metallocene catalyst (a) is used at the following density | concentration.
    Namely, the concentration of the metallocene compound (b) in the polymerization system is usually 0.00005 to 1.0 mmol / liter, preferably 0.0001 to 0.5 mmol / liter (polymerization volume).
    The organoaluminum oxy compound (c) is supplied in an amount of 0.1 to 10,000, preferably 1 to 5,000, in the ratio of aluminum atoms to the transition metal (Al / transition metal) in the metallocene compound (b) in the polymerization system. .
    The ionizing ionic compound (d) is 0.1 in molar ratio (ionizing ionic compound (d) / metallocene compound (b)) of the ionizing ionic compound (d) to the metallocene compound (b) in the polymerization system. 20, preferably 1-10.
    When using the organoaluminum compound (e), it is usually supplied in an amount of about 0 to 5 mmol / liter, preferably about 0 to 2 mmol / liter (polymerization volume).
    The copolymerization reaction for preparing the α-olefin / aromatic vinyl compound random copolymer is usually from -30 to 250 ° C, preferably from 0 to 80 kg / cm 2, preferably from 0 to 50 kg / cm 2 pressure (gauge pressure). It carries out at 0-200 degreeC temperature.
    Although reaction time (average residence time in the case of copolymerization by a continuous method) changes with catalyst concentration, polymerization temperature, and other conditions, they are 5 minutes-3 hours normally, Preferably they are 10 minutes-1.5 hours.
    In the production of the α-olefin / aromatic vinyl compound random copolymer, ethylene and an aromatic vinyl compound, and optionally an α-olefin having 3 to 20 carbon atoms are supplied to the polymerization system in an amount such that a copolymer having the specific composition is obtained.
    In the copolymer, a molecular weight regulator such as hydrogen can be used.
    When ethylene is copolymerized with an aromatic vinyl compound and, if necessary, an α-olefin having 3 to 20 carbon atoms, the α-olefin / aromatic vinyl compound random copolymer is obtained as a polymer solution containing it. This polymer solution is treated according to a conventional method to obtain an alpha -olefin / aromatic vinyl compound random copolymer.
    You may graft-polymerize monoolefin dicarboxylic acid or its anhydride to the said (alpha)-olefin / aromatic vinyl compound random copolymer (C). Examples of suitable monoolefindicarboxylic acids and their anhydrides include maleic acid, fumaric acid, itaconic acid, crotonic acid, isocrotonic acid, citraconic acid, acrylicsuccinic acid, mesaconic acid, glutamic acid, nadic acid (endo cis-bicyclo (2.2. 1) dicarboxylic acids such as hept-2-ene-5,6-dicarboxylic acid), methylnadic acid, tetrahydrophthalic acid and methylhexahydrophthalic acid; And anhydrides such as allyl succinic anhydride, glutaconic anhydride, nadic acid anhydride, and tetrahydrophthalic anhydride. At least one of these may be contained in the form of a graft unit in the graft-modified α-olefin / aromatic vinyl compound random copolymer (C).
    The graft modification degree by the monoolefin dicarboxylic acid or its anhydride is 0.1 to 20% by weight, in particular 0.5 to 10, from the viewpoint of preventing spreading and workability of the hot melt adhesive obtained from the graft-modified α-olefin / aromatic vinyl compound random copolymer. Weight percent is preferred. The graft modification degree here means the ratio of the graft copolymerized monomer with respect to the skeletal polymer which performs graft copolymerization. For example, when 1 g of the monomer is graft copolymerized to 100 g of the backbone polymer, the graft modification degree is 1% by weight.
    The graft modification of the α-olefin / aromatic vinyl compound random copolymer can be carried out by a conventional method (for example, a method disclosed in Special Publication 52-22988). For example, the graft modification may be performed by heating an α-olefin / aromatic vinyl compound random copolymer above a softening point to melt it, followed by dropwise addition of mono olefindicarboxylic acid or its anhydride and peroxide to the graft copolymer under stirring. Can be.
    Low Molecular Weight Polyolefin (D)
    In the present invention, the low molecular weight polyolefin (D) added as needed,
    (i) a polyolefin having a intrinsic viscosity ( ) of 0.01 to 0.6 dl / g as a homopolymer or a copolymer of two or more of α-olefins having 2 to 12 carbon atoms; And
    and (ii) saturated straight or saturated branched hydrocarbons having an intrinsic viscosity (η) of 0.01 to 0.6 dl / g.
    In the polyolefin (i), suitable examples of the α-olefin having 2 to 12 carbon atoms include ethylene, propylene, 1-butene, 1-pentene, 2-methyl-1-butene, 3-methyl-1-butene, 1-hexene , 3-methyl-1-pentene, 4-methyl-1-pentene, 3,3-dimethyl-1-butene, 1-heptene, methyl-1-hexene, dimethyl-1-pentene, trimethyl-1-butene, ethyl -1-pentene, 1-octene, dimethyl-1-hexene, trimethyl-1-pentene, ethyl-1-hexene, methylethyl-1-pentene, diethyl-1-butene, propyl-1-pentene, 1-decene And methyl-1-nonene, dimethyl-1-octene, trimethyl-1-heptene, ethyl-1-octene, methylethyl-1-heptene, diethyl-1-hexene and 1-dodecene.
    The polyolefin (i) can be prepared by various conventional methods. Examples of this method include low or medium pressure polymerization in the presence of various transition metal compound catalysts such as a high pressure radical polymerization or a Ziegler catalyst, a high molecular weight homopolymer or a copolymer prepared by the polymerization method, and then Pyrolysis method which reduces the molecular weight of a polymer or a copolymer by the pyrolysis method or the radical decomposition method using a peroxide is mentioned.
    Examples of suitable hydrocarbons (ii) include straight chain hydrocarbons such as paraffin wax and sasol wax and branched hydrocarbons such as micro wax. These waxes are known and commercially available.
    For example, Sasol wax can be produced by the following method.
    For example, coal is gasified using steam and oxygen to obtain a synthesis gas consisting primarily of carbon monoxide and hydrogen. This synthesis gas is passed through a fixed bed catalytic reactor by a known "ARGE process". From the reaction product obtained, a heavier fraction than diesel engine oil is distilled under reduced pressure to separate the first fraction (C 18 to C 23 ), the second fraction (C 22 to C 36 ), and the third fraction (C 33 or more). . The third fraction is hydrogenated to remove all unsaturated hydrocarbons and oxygen compounds to obtain sasol wax.
    Hot melt adhesive composition
    The first hot melt adhesive composition of the present invention,
    It consists of a tackifier (B) and the alpha-olefin / aromatic vinyl compound random copolymer (C).
    Specifically, the first hot melt adhesive composition,
    100 parts by weight of a tackifier (B), and
    0-900 weight part of alpha-olefin / aromatic vinyl compound random copolymers (C), Preferably it is 1-700 weight part.
    The 2nd hot melt adhesive composition of this invention consists of a base polymer (A), a tackifier (B), and the (alpha)-olefin / aromatic vinyl compound random copolymer (C). Specifically, the second hot melt adhesive composition,
    100 parts by weight of the base polymer (A),
    1 to 900 parts by weight of the tackifier (B), preferably 1 to 700 parts by weight and
    1-1000 weight part of (alpha) -olefin / aromatic vinyl compound random copolymers (C), Preferably it is 1-800 weight part.
    That is, the second hot melt adhesive composition is 1 to 10,000 parts by weight of the base polymer (A), preferably 15 to 10,000 parts by weight, α-olefin / aromatic vinyl compound random copolymer (C) per 100 parts by weight of the tackifier (B). 0.1 to 100,000 parts by weight, preferably 0.1 to 80,000 parts by weight.
    The third hot melt adhesive composition of the present invention comprises the base polymer (A), the tackifier (B) and the α-olefin / aromatic vinyl compound random copolymer (C). Specifically, the third hot melt adhesive composition,
    100 parts by weight of the base polymer (A),
    10 to 300 parts by weight of the tackifier (B), preferably 50 to 200 parts by weight and
    10-400 weight part of alpha-olefin / aromatic vinyl compound random copolymers (C), Preferably it is 30-300 weight part.
    The low molecular weight polyolefin (D) may be blended in an amount of 1 to 100 parts by weight, preferably 10 to 80 parts by weight, per 100 parts by weight of the tackifier (B) in the first hot melt adhesive composition of the present invention.
    A low molecular weight polyolefin (D) may be blended in an amount of 1 to 100 parts by weight, preferably 10 to 80 parts by weight, per 100 parts by weight of the base polymer (A) in the second hot melt adhesive composition of the present invention.
    The low molecular weight polyolefin (D) may be blended in an amount of 1 to 100 parts by weight, preferably 10 to 80 parts by weight, per 100 parts by weight of the base polymer (A) in the third hot melt adhesive composition of the present invention. Blending the low molecular weight polyolefin (D) with the optional first, second and third hot melt adhesive compositions lowers the melt viscosity of the hot melt adhesive composition and thus improves the workability of the hot melt adhesive composition. When blending the low molecular weight polyolefin (D), the intrinsic viscosity (η) of the α-olefin / aromatic vinyl compound random copolymer is preferably 0.6 dl / g or more and 10 dl / g or less.
    In addition to the base polymer (A), the tackifier (B), the α-olefin / aromatic vinyl compound random copolymer (C) and the low molecular weight polyolefin (D), if necessary, a softener, a stabilizer, a filler, an antioxidant, and the like. Various additives of may be blended into the hot melt adhesive composition in an amount that does not impair the object of the present invention.
    The second and third hot melt adhesive compositions of the present invention can be prepared by conventional methods. For example, the base polymer (A), the tackifier (B), and the α-olefin / aromatic vinyl compound random copolymer (C), if necessary, the low molecular weight polyolefin (D) and various additives may be used, such as a brabender platograph. The blender is added at a predetermined ratio, heated, melt-kneaded, and shaped into a desired shape, namely granular, flake, or rod. The 1st hot melt adhesive composition of this invention can also be manufactured by a method similar to the above using a tackifier (B) and the alpha-olefin / aromatic vinyl compound random copolymer (C).
    The hot melt adhesive composition of the present invention is heated and melted and applied to a coating body such as cloth, kraft paper, aluminum foil or other metal foil, polyester film or other resin molding by a conventional method, and an adhesive layer is formed thereon. use.
    The hot melt adhesive composition of the present invention exhibits excellent adhesion properties even when the styrene polymer is adhered to the polyolefin.
    Effects of the Invention
    The hot melt adhesive composition of the present invention is excellent in workability and adhesive strength.
    The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.
    Preparation Example 1
    Preparation of Ethylene / Styrene Random Copolymer
    A 1 liter glass reactor equipped with a condenser and a stirrer was sufficiently substituted with nitrogen, 494 ml of toluene and 6 ml of styrene were added thereto, followed by saturation with ethylene under stirring. Subsequently, the inside of the system was heated to 35 ° C., and 4.5 mmol of methylaluminoxane (doso azo, 10 wt% toluene solution) and (t-butyl-amido) dimethyl (tetramethyl-η 5 -cyclopentadienyl 0.045 mmol (0.01 mmol toluene solution) of silane titanium dichloride was added to the mixture. The polymerization was carried out at 40 ° C. for 60 minutes while continuously feeding ethylene at a rate of 100 N liters / hour. After the completion of the polymerization, 250 ml of isobutyl alcohol and 10 ml of hydrochloric acid aqueous solution were added to the mixture, and the mixture was heated at 80 ° C for 30 minutes under stirring. The reaction mixture containing isobutyl alcohol was transferred to a separatory funnel and washed twice with 250 ml of water to separate an oil phase and an aqueous phase. 3 liters of methanol was poured into the oil phase to precipitate the polymer. The precipitated and separated polymer was dried at 130 ° C. under reduced pressure for 12 hours to obtain an ethylene / styrene random copolymer (hereafter referred to as “ESC-1”). The molar ratio (ethylene unit / styrene unit) of the ethylene unit with respect to the styrene unit of ESC-1 was 97/3, and the intrinsic viscosity ((eta)) measured in 135 degreeC decalin of this ESC-1 was 1.6 dl / g.
    Preparation Example 2
    Preparation of Ethylene / Styrene Random Copolymer
    20 g of ESC-1 obtained in Preparation Example 1 was placed in a 50 ml Pyrex tube, and the inside thereof was sufficiently substituted with nitrogen. The Pyrex tube was mounted on an aluminum block heater heated to 380 ° C. and heated under nitrogen atmosphere for 60 minutes after 5 minutes. Thereafter, the mixture was allowed to cool to obtain a waxy ethylene / styrene random copolymer (herein referred to as "ESC-2"). The molar ratio (ethylene unit / styrene unit) of the ethylene unit with respect to the styrene unit of ESC-2 was 97/3, and the intrinsic viscosity ((eta)) measured in 135 degreeC decalin of this ESC-2 was 0.2 dl / g. The yield was 99.2%.
    Preparation Example 3
    Preparation of Ethylene / Styrene Random Copolymer
    Except for using isopropylidene-bis (indenyl) zirconium dichloride synthesized by conventional methods in place of (t-butyl-amido) dimethyl (tetramethyl-η 5 -cyclopentadienyl) silane titanium dichloride Was obtained in the same manner as in Preparation Example 1 to an ethylene / styrene random copolymer (ESC-3). The molar ratio (ethylene unit / styrene unit) of the ethylene unit with respect to the styrene unit of ESC-3 was 96/4, and the intrinsic viscosity ((eta)) measured in 135 degreeC decalin of this ESC-3 was 1.3 dl / g.
    Preparation Example 4
    Preparation of Ethylene / Styrene Random Copolymer
    The same procedure as in Preparation Example 2 was repeated except that the copolymer (ESC-3) prepared in Preparation Example 3 was used as a copolymer, thereby obtaining an ethylene / styrene random copolymer (here, referred to as "ESC-4"). The molar ratio (ethylene unit / styrene unit) of the ethylene unit with respect to the styrene unit of ESC-4 was 96/4, and the intrinsic viscosity ((eta)) measured in 135 degreeC decalin of this ESC-4 was 0.2 dl / g.
    Preparation Example 5
    Preparation of Ethylene / Styrene Random Copolymer
    Ethylene / styrene random copolymers (herein referred to as "ESC-5") were prepared in the same manner as in Preparation Example 1, except that the amounts of toluene and styrene were set to 485 ml and 15 ml, respectively. The molar ratio (ethylene unit / styrene unit) of the ethylene unit with respect to the styrene unit of ESC-5 was 88/12, and the intrinsic viscosity ((eta)) measured in 135 degreeC decalin of this ESC-3 was 1.5 dl / g.
    Example 1
    25 g of styrene / ethylene / butylene / styrene block copolymer (trade name: Creton G1657, manufactured by Shell Chemicals Inc., herein referred to as “SEBS”), 15 g of ESC-1 obtained in Production Example 1, aliphatic petroleum resin (trade name: Hi-rez 40 g of T-500X, manufactured by Mitsui Chemicals Inc., herein referred to as "petroleum resin H" and 20 g of Sasol Wax (trade name: Sasol HI, imported from S.Kato Corporation) were melt-kneaded at 180 ° C. to prepare a hot melt adhesive composition. Got it.
    The hot melt adhesive composition was applied on an aluminum foil (50 µm) at a thickness of 15 µm, and the coating surfaces were connected to each other. The heat sealer was heat-sealed under the conditions of 170 degreeC, 70 degreeC, 1 kg / cm <2>, and 2 second in the upper bar temperature, lower bar temperature, pressure, and pressurization time, respectively, and the laminated sheet was obtained. This laminated sheet was cut out into a specimen having a width of 25 mm. The adhesive strength was measured by the 180 degree peeling test under the tensile speed of 300 mm / sec using the tensile tester. The results are shown in Table 1.
    Comparative Example 1
    The same procedure as in Example 1 was repeated except that 40 g of SEBS was added and no ESC-1 was used.
    The results are shown in Table 1.
    Example 2
    The same procedure as in Example 1 was repeated except that an aliphatic petroleum resin (trade name: Petrocin, manufactured by Mitsui Chemicals Inc., referred to herein as "petroleum resin P") was used instead of the petroleum resin H.
    The results are shown in Table 1.
    Comparative Example 2
    The same method as in Comparative Example 1 was repeated except that petroleum resin P was used instead of pentene aliphatic petroleum resin.
    The results are shown in Table 1.
    Example 3
    The same procedure as in Example 1 was repeated except that 40 g of SEBS, 40 g of petroleum resin H, and 20 g of ESC-2 were used as the composition components.
    The results are shown in Table 1.
    Example 4
    The same procedure as in Example 1 was repeated except that 40 g of SEBS, 40 g of petroleum resin P, and 20 g of ESC-2 were used as the composition components.
    The results are shown in Table 1.
    Example 5
    The same procedure as in Example 1 was repeated except that copolymer ESC-3 prepared in Preparation Example 3 was used as the copolymer component.
    The results are shown in Table 1.
    Example 6
    The same method as in Example 3 was repeated except that copolymer ESC-4 prepared in Preparation Example 4 was used as the copolymer component.
    The results are shown in Table 1.
    Composition of Hot Melt Adhesive Composition (g)Adhesive strength (N / 25mm) 0 ℃20 ℃40 ℃ Example 1SEBS 25 petroleum resin H 40ESC-1 15 sole wax 205.19.014.2 Comparative Example 1SEBS 40 Petroleum Resin H 40 Brushed Wax 203.34.010.7 Example 2SEBS 25 Petroleum Resin P 40ESC-1 154.88.813.0 Comparative Example 2SEBS 40 Petroleum Resin P 40 Brushed Wax 202.53.510.1 3 to implementationSEBS 40 Petroleum Resin H 40ESC-2 204.68.012.3 Example 4SEBS 40 Petroleum Resin P 40ESC-2 204.07.111.8 Example 5SEBS 25 Petroleum Resin H 40ESC-3 15 Brushed wax 204.88.813.5 Example 6SEBS 40 Petroleum Resin H 40ESC-4 204.17.511.5
    Example 7
    40 g of the copolymer ESC-5 obtained in Production Example 5 and a C 9 petroleum resin hydrogenated product (trade name: Arkon P-100, manufactured by Aragawa Chemical Co., Ltd.) were melt kneaded to obtain a hot melt adhesive composition. The laminated sheet was molded as a test specimen from this hot melt adhesive composition, and then a peel test was conducted in the same manner as in Example 1. The measured adhesive strength was 4.0 N / 25 mm at 0 degreeC, 7.1 N / 25 mm at 20 degreeC, 18.6 N / 25 mm at 40 degreeC, and 32.8 N / 25 mm at 60 degreeC.
    The results are summarized in Table 2.
    Example 8
    A hot melt adhesive composition and a laminated sheet were prepared in the same manner as in Example 7, except that an aromatic hydrocarbon resin (trade name: FTR 6100, manufactured by Mitsui Chemicals Co., Ltd.) was used instead of the C 9 petroleum resin hydrogenated material, and a peel test was also performed. The measured adhesive strength was 5.7 N / 25 mm at 0 degreeC, 9.8 N / 25 mm at 20 degreeC, 26.3 N / 25 mm at 40 degreeC, and 34.0 N / 25 mm at 60 degreeC.
    The results are summarized in Table 2.
    Comparative Example 3
    Hot-melt adhesive in the same manner as in Example 7, except that styrene / butadiene / styrene triblock copolymer hydrogenated (trade name: Creton G1657, manufactured by Shell Chemicals) was used instead of the copolymer ESC-5 prepared in Preparation Example 5. The composition and the laminated sheet were prepared and subjected to a peel test. The measured adhesive strength was 5.3N / 25mm at 0 degreeC, 12.3N / 25mm at 20 degreeC, 10.4N / 25mm at 40 degreeC, and 9.7N / 25mm at 60 degreeC. The results are summarized in Table 2.
    Comparative Example 4
    Hot-melt adhesive in the same manner as in Example 8 except that styrene / butadiene / styrene triblock copolymer hydrogenated (trade name: Creton G1657, manufactured by Shell Chemicals) was used instead of the copolymer ESC-5 prepared in Preparation Example 5. The composition and the laminated sheet were prepared and subjected to a peel test. The measured adhesive strength was 2.7 N / 25 mm at 0 degreeC, 4.6 N / 25 mm at 20 degreeC, 5.6 N / 25 mm at 40 degreeC, and 2.6 N / 25 mm at 60 degreeC. The results are summarized in Table 2.
    Composition of Hot Melt Adhesive Composition (g)Adhesive strength (N / 25mm) 0 ℃20 ℃40 ℃60 ℃ Example 7C 9 Petroleum Resin Hydroxide 80ESC-5 404.07.118.632.8 Example 8Aromatic Hydrocarbon Resin 80ESC-5 405.79.826.334.0 Comparative Example 3C 9 Petroleum Resin Hydroxide 80 Styrene / Butadiene / Styrene Triblock Copolymer Hydrolyzate 405.312.310.49.7 Comparative Example 4Aromatic Hydrocarbon Resin 80 Styrene / Butadiene / Styrene Triblock Copolymer Hydroxide 402.74.65.62.6
    权利要求:
    Claims (9)
    [1" claim-type="Currently amended] 100 parts by weight of a tackifier (B), and
    α-olefin / aromatic vinyl compound random copolymer (C) 1 to 900 parts by weight of a hot melt adhesive composition.
    [2" claim-type="Currently amended] 100 parts by weight of the base polymer (A),
    1 to 900 parts by weight of the tackifier (B), and
    α-olefin / aromatic vinyl compound random copolymer (C) A hot melt adhesive composition comprising 1 to 1000 parts by weight.
    [3" claim-type="Currently amended] 100 parts by weight of the base polymer (A),
    10 to 300 parts by weight of the tackifier (B), and
    10-400 parts by weight of an α-olefin / aromatic vinyl compound random copolymer (C).
    [4" claim-type="Currently amended] The method according to claim 2 or 3,
    Hot melt adhesive wherein the base polymer (A) is at least one polymer selected from the group consisting of polyolefins (a-1), polymers containing polar groups (a-2) and aromatic vinyl compounds / conjugated diene copolymers (a-3) Composition.
    [5" claim-type="Currently amended] The method according to claim 2 or 3,
    The hot-melt adhesive composition wherein the base polymer (A) is an aromatic vinyl compound / conjugated diene copolymer (a-3).
    [6" claim-type="Currently amended] The method according to any one of claims 1 to 5,
    The hot-melt adhesive composition wherein the α-olefin / aromatic vinyl compound random copolymer (C) is an ethylene / aromatic vinyl compound random copolymer.
    [7" claim-type="Currently amended] The method according to any one of claims 1 to 6,
    And a -Olefin / aromatic vinyl compound random copolymer (C) containing 1 to 80 mol% of structural units derived from an aromatic vinyl compound.
    [8" claim-type="Currently amended] The method according to any one of claims 2 to 7,
    In addition to the base polymer (A), the tackifier (B) and the α-olefin / aromatic vinyl compound random copolymer (C), a low molecular weight polyolefin (D) having an intrinsic viscosity (η) of 0.01 to 0.6 dl / g Hot melt adhesive composition further comprises 1 to 100 parts by weight per 100 parts by weight of the base polymer (A).
    [9" claim-type="Currently amended] The method according to claim 1, 6 or 7,
    In addition to the tackifier (B) and the α-olefin / aromatic vinyl compound random copolymer (C), a low molecular weight polyolefin (D) having an intrinsic viscosity (η) of 0.01 to 0.6 dl / g is added to the tackifier (B). ) Hot melt adhesive composition further comprises 1 to 100 parts by weight per 100 parts by weight.
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    同族专利:
    公开号 | 公开日
    ID21997A|1999-08-19|
    DE69822797T2|2005-03-10|
    CA2278736A1|1998-08-06|
    AU5574898A|1998-08-25|
    EP0957147A4|2000-09-13|
    US6235818B1|2001-05-22|
    KR100386372B1|2003-06-02|
    EP0957147B1|2004-03-31|
    AU733854B2|2001-05-31|
    CN1244889A|2000-02-16|
    WO1998033861A1|1998-08-06|
    TW513478B|2002-12-11|
    CN1104480C|2003-04-02|
    DE69822797D1|2004-05-06|
    EP0957147A1|1999-11-17|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1997-01-30|Priority to JP1711097
    1997-01-30|Priority to JP97-17110
    1998-01-21|Application filed by 나까니시 히로유끼, 미쓰이 가가쿠 가부시키가이샤
    1998-01-21|Priority to PCT/JP1998/000211
    2000-11-25|Publication of KR20000070535A
    2003-06-02|Application granted
    2003-06-02|Publication of KR100386372B1
    优先权:
    申请号 | 申请日 | 专利标题
    JP1711097|1997-01-30|
    JP97-17110|1997-01-30|
    PCT/JP1998/000211|WO1998033861A1|1997-01-30|1998-01-21|Hot melt adhesive compositions|
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